Structure de mise en forme 2 colonnes

Interuniversity Microelectronics Center


The Interuniversity Microelectronics Center (IMEC) is Flanders’ independent research institute in microelectronics founded in 1984 by the Flemish Government. IMEC plays an important role in Europe as an independent laboratory, which anticipates the industrial needs in the field of microelectronics. IMEC’ s mission is “To perform R&D, ahead of industrial needs by 3 to 10 years, in microelectronics, nanotechnology, design methods and technologies for ICT systems” . IMEC has as objectives to be an “international center of excellence”, to reinforce the local industry, to cooperate intensely with Flemish universities and to provide industrial training in ICT. IMEC’ s activities include new chips production processes, Microsystems and new electronic components, development of solar cells and plastic electronics, and new packaging technologies.
Within the Process Technology (PT) unit of IMEC, the Packaging, Microsystem and Hybrid Technology (PAMAHT) group represents IMEC competence center with respect to the most advanced state-of-the-art research on IC and MEMS packaging, thin film technologies, 3D and Microsystems integration.



Role of IMEC in the FAB2ASM project

In WP2, IMEC will be fabricate test vehicles for self-aligment, including surface coatings, and silicon benches for VCSELs. IMEC will also fabricate. In WP4, IMEC will study self-alignment compatible intermetallic compounds. IMEC is the leader of WP2.


Key person

Philippe Soussan. In 1999, he obtained a master of science in mechanical engineering from ENSAM (Paris, France). In 2000, he graduated from ENSMP (Paris, France) with a masters in material sciences. His field of expertise covers the interaction between processes and material properties, as well as technology integration in advanced packaging and Microsystems. In 2001, he joined IMEC as a technology researcher for multi-chip modules. Later he became the recipient for an outstanding paper award at MRS Fall 2004. Since 2007, he is leading the group “Packaging, Microsystems and Hybrid Technology”, at IMEC. The group deals with complex process integration using 3D interconnects and micro fabrication of “More than Moore” devices. He has authored or coauthored more than 30 publications in this field.


Philippe Soussan
Kapeldreef 75
3001 Leuven
Interuniversity Microelectronics Center