NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power, Digital Processing and manufacturing expertise. These innovations are used in a wide range of automotive, industrial, consumer, lighting, medical, computing and identification applications. Headquartered in Europe, the company has about 29,000 employees working in more than 30 countries and posted sales of USD 5.4 billion in 2008.
NXP takes part with three competence groups: ITEC, CSC-Innovation and Back-end Innovation.
NXP-ITEC stands for Industrial Technology and Engineering Center. It was founded in 1991 as a successor of the BM (Bedrijfsmechanisatie). Its primary focus is to generate cost effective assembly equipment for mass production of low-pincount semiconductors. Manufacturing of NXP-ITEC equipment is fully subcontracted. ITEC invented the BIM (Breakthrough in Manufacturing) concept: a high volume flowline for assembly of low pincount semiconductors.
CSC-Innovation stands for “Competence Support Center-Innovation”, which is located in Nijmegen, The Netherlands. The aim of this group is to support the Business Lines with the development of innovative solutions for low-pincount packages, platform-concepts, processes and technologies.